About the role#
This internship focuses on developing and validating laboratory methods to detect and characterize small defects in brittle materials and multi-material structures. You will work under the guidance of technical staff to investigate damage occurring during thermal-mechanical reliability stresses or through post-stress inspection. Your work will help establish the detection limits of these methods and correlate findings with underlying failure mechanisms to support physics-based and empirical reliability models.
What you'll do#
- Review technical literature on non-destructive evaluation, acoustic emission, ultrasonic sensing, and reliability mechanisms in electronic packaging.
- Plan and run experiments, including building and calibrating sensors, data acquisition systems, and test setups.
- Apply acoustic emission or ultrasonic methods to detect and locate damage during thermal cycling.
- Commission and apply laboratory imaging systems, including automated image analysis and machine vision for defect detection.
- Acquire, process, and analyze sensor waveforms and image data using tools like MATLAB or Python.
- Correlate detected events with ground truth data from microscopy, sectioning, and failure analysis.
- Quantify detection thresholds and noise to identify which damage mechanisms are detectable.
- Document methods, follow laboratory safety practices, and communicate findings in reports and presentations.
What you'll need#
- Current enrollment in a graduate program (PhD preferred) in mechanical, materials, reliability, electrical or computer engineering, applied physics, optics, or a related field.
- Research or hands-on laboratory experience in at least one of the following: acoustic emission, ultrasonics, non-destructive evaluation, optical imaging, machine vision, reliability testing, life modeling, or failure analysis.
- Experience with signal or image processing using MATLAB, Python, or similar tools.
- Strong analytical and problem-solving skills with attention to detail.
- Ability to work collaboratively with scientists and engineers while completing independent tasks.
- Availability for 10 weeks during Summer 2027 (May-August 2027) with a graduation date of December 2027 or later.
- Interest in potential full-time employment with Corning, Inc. after graduation.
Location & details#
- Location: Corning, New York.
- Term: Summer 2027 (10 weeks).
- Modality: On-site.
- Compensation: This is a paid position with a biweekly range of $1,635.00 to $3,185.00. Starting pay is determined by geographic location, position nature, and year in school.
- Note: This position does not support immigration sponsorship.
About Corning Incorporated
Corning Incorporated operates as a manufacturer in the glass, ceramics, and concrete sectors. Founded in 1851, the company maintains its headquarters in Corning, New York. It employs over 22,000 people across its global operations. The firm focuses on optical communications, mobile consumer electronics, display technology, automotive components, and life sciences equipment.
How to get in at Corning Incorporated
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