About the role#
Join the System Level Test team within the Technology Development organization as a Mechanical Design and Thermal Engineering Intern. You will work with experienced engineers to design, analyze, and optimize mechanical and thermal solutions for complex test hardware. This role involves contributing to next-generation test platforms through concept development, CAD design, thermal analysis, prototyping, and system integration. You will gain hands-on experience in structural design, cooling technologies, and manufacturability while solving real-world engineering challenges.
What you'll do#
- Design and develop mechanical devices, systems, equipment, and packaging.
- Create practical mechanical designs that incorporate design for manufacture, serviceability, and sustainability.
- Develop system concepts from scratch and create product and test specifications.
- Drive system integration, development, procurement, acceptance, and deployment to high-volume manufacturing.
- Define and conduct feasibility studies and develop test plans for new and existing designs.
- Validate functionality, reliability, and safety of mechanical solutions.
- Select materials, components, and manufacturing technologies.
- Coordinate with suppliers to incorporate feedback and resolve manufacturing issues.
- Conduct design reviews and system acceptance tests.
- Drive structural and stress analysis of mechanical components.
- Prototype and test designs to initiate improvements and resolve implementation issues.
- Create mechanical finite-element model geometry and meshing with parametric scripting.
- Execute and post-process static or transient simulations.
- Perform tolerance analysis from component level to system level.
- Collaborate with thermal, electromechanical, industrial design, and system engineering teams.
- Partner with external vendors through conceptual studies, layout, design, fabrication, assembly, and validation.
What you'll need#
- Current pursuit of a master's degree in mechanical engineering or a relevant field.
- At least 1 year of hands-on experience in the domain through internships, projects, or coursework.
- Proficiency in 3D modeling and AutoCAD.
- Knowledge of design for manufacturing principles.
- Understanding of mechanical design fundamentals, hardware design, and reliability and thermal principles.
- A GPA of 3.0 or higher.
- Strong problem-solving and group collaboration skills.
- Effective communication skills for cross-functional teamwork.
- Ability to innovate and adapt designs for diverse applications.
Location & details#
- Locations: Hillsboro, Oregon or Phoenix, Arizona.
- Work Modality: On-site.
- Employment Type: Full-time, paid internship.
- Term: Rolling.
About Intel Corporation
Intel Corporation designs and manufactures semiconductors. The company focuses on artificial intelligence, autonomous driving, and non-volatile memory solutions. It operates as a public company with over 110,000 employees. The headquarters are in Santa Clara, California, with major office locations across the United States, Israel, France, Singapore, and Poland.
How to get in at Intel Corporation
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