About the role#
Join the Advanced Packaging Technology Development team at Micron. You will work alongside engineers to build next-generation interconnect technologies. This role focuses on improving semiconductor performance, reliability, and packaging capabilities through hands-on development. You will participate in projects involving hybrid bonding, micro bump technology, TSV, and thermal management.
What you'll do#
- Lead structured problem-solving using Kepner-Tregoe methodologies to fix process and yield issues.
- Design, run, and analyze experiments for advanced packaging and interconnect process development.
- Review process, line-monitoring, and yield data to create new metrics that support process optimization.
- Present technical findings and work with engineering teams across different sites and functions.
- Use AI and Code Assist to build agent-based solutions that improve engineering workflows and data analysis.
What you'll need#
- Current enrollment in a Master’s or PhD program in a semiconductor-related field.
- Expected graduation date between Fall 2027 and Summer 2028.
- Experience with data extraction, statistical analysis, and technical reporting using JMP or similar tools.
- Ability to manage multiple technical projects and adapt to changing priorities.
- Experience with AI, Code Assist, or agent-based solutions for technical applications.
- Background in semiconductor process technologies such as BEOL, advanced interconnect, or thermal management.
- Familiarity with structured problem-solving techniques and designing experiments.
Location & details#
- Location: Boise, Idaho.
- Employment type: Full-time.
- Modality: On-site.
- Term: Rolling.
About Micron Technology
Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.
How to get in at Micron Technology
Applying early is a distinct advantage at Micron Technology because recruiters often review candidates before the applicant pool becomes unmanageable. Intern Insider sends an instant alert the moment a role matching your target is published, helping you get your application in among the first. This timing ensures your resume is seen while the team is still actively building their shortlist. You can reach out to recruiters directly to ask about the role or a referral, which often improves your response rate compared to waiting in a queue. Intern Insider surfaces the specific recruiters behind these roles, allowing you to bypass the generic portal and make a professional connection. This approach turns a standard application into a direct conversation.
