Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)

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Samsung Semiconductor

10,001+ employeesSan Jose, California, United StatesSemiconductor Manufacturing
Actively hiringPaidSemiconductor Manufacturing
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Best applied by Nov 27

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About the role#

Samsung Semiconductor is seeking a thermal engineering intern to join the Power & Thermal Lab. You will work on building and calibrating models for HBM stacks and packages to support the development of next-generation AI memory technologies. This role involves direct ownership of specific platform components, ranging from physics-based CFD references to validated models that inform design decisions for architecture, power, and package teams.

What you'll do#

  • Build and calibrate CFD models (Simcenter Flotherm) of HBM stacks and packages under realistic cooling conditions.
  • Extend compact thermal models to new stack heights, die configurations, and base-die power levels.
  • Quantify model accuracy against CFD results in both steady state and transient conditions.
  • Develop homogenization methods to replace fine features, such as TSV arrays and micro-bumps, with effective properties.
  • Improve thermal solver speeds using model-order reduction, sparse linear algebra, preconditioning, GPU acceleration, or machine-learning surrogates.
  • Run transient simulations using real AI workload traces to identify spatiotemporal hotspots and explore thermal-aware policies.
  • Evaluate advanced cooling options and thermal-interface materials, translating findings into design guidance.
  • Couple thermal models with the lab's trace-driven power simulation engine.
  • Document methods and results for presentation to engineers and lab leadership.

What you'll need#

  • Currently pursuing a PhD (preferred) or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Applied Physics, or a related field.
  • At least one academic quarter or semester remaining in your program.
  • A strong foundation in heat transfer, specifically transient conduction in multi-layer solids and thermal contact resistance.
  • Hands-on experience with numerical methods, such as finite-volume, finite-element, or finite-difference.
  • Proficiency in scientific programming using Python or MATLAB.
  • Ability to critically evaluate simulation results, including mesh convergence and energy balance, and explain discrepancies between models.
  • Experience with Simcenter Flotherm, Ansys Icepak/Fluent, or COMSOL is preferred.
  • Familiarity with compact or reduced-order thermal models, ML surrogates, electronics packaging, 3D-IC thermal management, HPC, or GPU programming is a plus.

Location & details#

  • Location: San Jose, California.
  • Modality: On-site.
  • Employment type: Full-time internship.
  • Compensation: Paid position.

About Samsung Semiconductor

Samsung Semiconductor operates as a subsidiary of Samsung Electronics. The company manufactures semiconductor components for device makers. It started operations in 1974. The organization employs more than 10,000 people.

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