About the role#
This internship position sits within the HBM organization. You will join a team focused on advancing High Bandwidth Memory solutions through characterization, modeling, and root-cause analysis. The role supports Design Technology Co-Optimization objectives by building a first-principles understanding of HBM cube limitations through silicon data and models. You will perform custom bench-level characterization under various stress conditions to improve product performance, reliability, and yield.
What you'll do#
- Design, build, and debug custom bench-level test setups, fixtures, and measurement flows using laboratory equipment.
- Perform thermal, mechanical, and electrical characterization of HBM cubes under hot, cold, and transient conditions.
- Develop and maintain test programs, stress patterns, and workloads using Python, Verilog, or C/C++.
- Analyze MBIST signatures and complex datasets to identify root causes and recommend corrective actions.
- Use AI, Agentic AI, and Generative AI tools to improve engineering workflows, data analysis, and test development efficiency.
What you'll need#
- Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.
- At least 3 years of experience in semiconductor characterization, failure analysis, or product and test engineering.
- Hands-on experience with laboratory equipment like oscilloscopes, SMUs, power supplies, thermal systems, and probe stations.
- Programming experience in Python plus one additional language such as C/C++ or Verilog.
- Experience analyzing complex datasets and driving root-cause investigations.
- Preferred: Master's or PhD degree in a related field.
- Preferred: Experience with DRAM, HBM, memory subsystems, or advanced semiconductor packaging.
- Preferred: Knowledge of reliability, yield improvement, DOE methodologies, and power-performance correlation.
- Preferred: Proficiency with AI-enabled tools for engineering productivity and workflow automation.
Location & details#
- This role is based in Richardson, Texas.
- This is an on-site position.
- This is a paid, full-time internship.
About Micron Technology
Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.
How to get in at Micron Technology
Applying early is a distinct advantage at Micron Technology because recruiters often review candidates before the applicant pool becomes unmanageable. Intern Insider sends an instant alert the moment a role matching your target is published, helping you get your application in among the first. This timing ensures your resume is seen while the team is still actively building their shortlist. You can reach out to recruiters directly to ask about the role or a referral, which often improves your response rate compared to waiting in a queue. Intern Insider surfaces the specific recruiters behind these roles, allowing you to bypass the generic portal and make a professional connection. This approach turns a standard application into a direct conversation.


